DocumentCode
3477758
Title
Ag modified carbon nanotubes as filler for thermal interface materials
Author
Zhi Zhang ; Xiaoliang Zeng ; Ling Zhang ; Pengli Zhu ; Kai Zhang ; Xianzhu Fu ; Rong Sun ; Yuen, M.M.F. ; Wong, C.P.
Author_Institution
Shenzhen Inst. of Adv. Technol., Shenzhen, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
301
Lastpage
303
Abstract
Ag surface modified carbon nanotubes (CNT) were prepared by electro-less plating method. The thermal interface materials (TIM) were obtained by mixed epoxy and nanotubes. The conductivity of expoxy-Ag coated CNT was much higher than that of epoxy-CNT. The Ag modified CNT is a promising high thermal conductive filler for polymer-based TIM.
Keywords
carbon nanotubes; electronics packaging; electroplating; silver; Ag; C; electro-less plating method; high thermal conductive filler; mixed epoxy; surface modified carbon nanotubes; thermal interface materials; Carbon nanotubes; Conductivity; Electronic packaging thermal management; Polymers; Surface treatment; Thermal conductivity; carbon nanotube; electroless plating; filler; silver; thermal interface materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756476
Filename
6756476
Link To Document