Title :
A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics
Author :
Yu Zhang ; Pengli Zhu ; Rong Sun ; Chingping Wong
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.
Keywords :
conducting polymers; copper; heat treatment; nanoparticles; printed circuits; sintering; Cu; conductive films; conductive ink; conductive patterns; dispersive distribution; flexible substrate; large scale copper nanoparticles; monodispersed size distribution; printed electronics; silk screen printing; temperature 250 degC; time 30 min; Conductivity; Copper; Dispersion; Ink; Nanoparticles; Printing; Substrates; Conductive ink; Copper nanoparticles; PCB; Patterns;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756479
