Title :
Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging
Author :
Xiaoying Liu ; Mingliang Huang ; Ning Zhao ; Lai Wang
Author_Institution :
Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China
Abstract :
The growth kinetics and morphology of the interfacial intermetallic compound (IMC) Cu6Sn5 between Sn-3Ag-0.5Cu-xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate during aging were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250°C and then aged at 150°C. The Fe element tended to suppress the growth of the Cu3Sn layer during solid-state aging. However, the total thickness of IMCs (Cu6Sn5 + Cu3Sn) for the composite solders with Fe particles was similar to that for SnAgCu without Fe particles.
Keywords :
ageing; copper alloys; iron alloys; reflow soldering; silver alloys; solders; tin alloys; Cu6Sn5; SnAgCuFe-Cu; composite solders; growth kinetics; interfacial intermetallic compound; interfacial reactions; reflowing; solid state aging; temperature 150 degC; temperature 250 degC; Aging; Intermetallic; Iron; Microstructure; Soldering; Substrates; Tin; Composite lead-free solder; Growth kinetics; Intermetallic compound;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756499
