Characterization for graphene as heat spreader using thermal imaging method

Author

Shirong Huang ; Yong Zhang ; Shuangxi Sun ; Xiaogang Fan ; Ling Wang ; Yifeng Fu ; Yan Zhang ; Johan Liu

Author_Institution

Dept. of Electron. Inf. Mater., Shanghai Univ., Shanghai, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

403

Lastpage

408

Abstract

Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader in electronic packaging. Platinum (Pt) was functioned as hot spot of thermal testing chip. The hot spot temperature of thermal testing chip bonded onto a heat sink measured by an FLIR infrared thermograph was decreased by about 5 °C from 52 °C to 47 °C when driven at a heat flux about 1280W/cm² with a graphene heat spreader attached. It is conceivable that further improvements to the cooling performance of graphene heat spreader can be made by optimizing the synthesis parameters and transfer process.

Keywords

chemical vapour deposition; cooling; electronics packaging; graphene; heat sinks; infrared imaging; platinum; FLIR infrared thermograph; Pt; TCVD; cooling performance; electronic packaging; heat flux; heat sink; heat spreader; hot spot temperature; monolayer graphene; synthesis parameter optimization; temperature 52 degC to 47 degC; thermal chemical vapor deposition; thermal imaging method; thermal testing chip; transfer process; Graphene; Heat sinks; Resistance heating; Temperature measurement; Testing; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756500

Filename

6756500