DocumentCode :
3478454
Title :
A thixotropic model for solving the flow of the semi-solid metal slurry
Author :
Fu Jinlong ; Wang Kaikun
Author_Institution :
Sch. of Mater. & Eng., Univ. of Sci. & Technol. Beijing, Beijing, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
421
Lastpage :
424
Abstract :
Thixoforming has already been used in the field of electronic packaging. The main problem in the production is the lack of the mathematic models which describe the thixotropy of the semi-solid metal and alloy. In this paper the effects of thixotropy to the flow characteristics and material properties are researched. The paper uses the Herschel-Bulkey model to describe the constitutive equation. The MacCormack method is adopted for solving the highly non-linear problem. The results show that the semi-solid slurry is strongly influenced by the time and the flow can be significantly different by changing the thixotropic constant. The paper contributes to a better understanding of thixotropy in semi-solid slurry.
Keywords :
electronics packaging; metallisation; slurries; thixoforming; thixotropy; Herschel Bulkey model; MacCormack method; electronic packaging; material properties; semisolid metal slurry; thixoforming; thixotropic model; Indexes; Mathematical model; Metals; Slurries; Solids; Stress; Structural engineering; Bingham model; Numberical simulation; Structural parameter; Thixotropic behavior;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756504
Filename :
6756504
Link To Document :
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