Low thermal resistance design for a 2.5D package

Author

Xiaomeng Wu ; He Ma ; Xiaoyang Liu ; Daquan Yu

Author_Institution

Jiangsu R&D Center for Internet of Things, Nat. Center for Adv. Packaging, Wuxi, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

431

Lastpage

434

Abstract

Because of closer chip packing and thinner cross section, a 2.5 D interposer is exposed to higher thermal loads than is a 2D package, and this can lead to higher die operating temperatures. In the presence of an interposer, heat transfer can occur through the interposer itself just below the die as well the traditional path through the topside heat sink. Heat transfer simulations using ANSYS Finite Element Method (FEM) and Finite Volume Method (FVM) are used to optimize construction of a more efficient thermal package to increase thermal management options.

Keywords

finite element analysis; finite volume methods; heat sinks; heat transfer; thermal management (packaging); thermal resistance; 2.5 D interposer; 2.5 D package; 2D package; ANSYS finite element method; FEM; FVM; chip packing; finite volume method; heat transfer simulations; low thermal resistance design; thermal loads; thermal management options; thermal package; topside heat sink; Electronic packaging thermal management; Electronics packaging; Heat sinks; Packaging; Resistance heating; Thermal resistance; 2.5D package; ANSYS; heat sink; interposer; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756506

Filename

6756506