DocumentCode
3478706
Title
Room-temperature fabrication of flexible gallium-doped zinc oxide thin-film transistors on plastic substrates
Author
Fuqing Huang ; Dedong Han ; Dongfang Shan ; Yu Tian ; Suoming Zhang ; Yingying Cong ; Yi Wang ; Lifeng Liu ; Xing Zhang ; Shengdong Zhang
Author_Institution
Inst. of Microelectron. Peking Univ., Beijing, China
fYear
2013
fDate
3-5 June 2013
Firstpage
1
Lastpage
2
Abstract
Bottom-gate-type oxide thin-film transistors (TFTs) on flexible plastic substrates have been fabricated, with Gallium-doped ZnO (GZO) by radio frequency (RF) sputtering as the channel material at room temperature. The devices use SiO2 as gate insulator and indium tin oxide (ITO) as gate, source and drain electrodes. To optimize performance of AZO TFTs, we studied effects of different oxygen/argon gas flow ratio on electrical properties of TFTs. We found that O2/Ar flow ratio influence the performance of GZO TFTs very significantly. Finally, we gained high performance GZO TFTs with excellent electrical properties, such as a drain current on/off ratio of 107, a subthreshold swing of 394mV/decade, a threshold voltage of 3.2V, and a field effect mobility of 20.7cm2/ V·s in saturation region.
Keywords
II-VI semiconductors; flexible electronics; gallium; plastics; silicon compounds; sputtering; thin film transistors; wide band gap semiconductors; zinc compounds; ITO; RF sputtering; SiO2; ZnO:Ga; bottom-gate-type oxide thin-film transistors; drain electrodes; electrical properties; field effect mobility; flexible gallium-doped zinc oxide thin-film transistors; flexible plastic substrates; gate electrodes; gate insulator; oxygen-argon gas flow ratio; radiofrequency sputtering; room-temperature fabrication; saturation region; source electrodes; temperature 293 K to 298 K; voltage 3.2 V; Indium tin oxide; Logic gates; Magnetic films; Substrates; Gallium-doped ZnO; flexible; oxygen/argon gas flow ratio; room temperature; thin-film transistor;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location
Hong Kong
Type
conf
DOI
10.1109/EDSSC.2013.6628232
Filename
6628232
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