Title :
A new method on Cu stress measurement by bandgap voltage reference circuit
Author :
Tan Chan Lik ; Tan Chun Keat ; Thilaga, Govindasamy ; Cheng Chin Siong
Author_Institution :
Technol. Dept., Infineon Technol. (Kulim) Sdn Bhd, Kulim, Malaysia
Abstract :
Cu metallization is not only used in low power logic circuit but also in high power automotive application because of its low resistance and robustness in repetitive clamping. How to characterize the stress in Cu metallization is a crucial issue in BEOL integration scheme. In this paper we design a circuit with bandgap reference voltage and overVoltage capability which are able characterize the correlation of Cu stress and in line wafer bow through electrical measurement.
Keywords :
copper; energy gap; integrated circuit design; integrated circuit metallisation; reference circuits; stress measurement; BEOL integration scheme; Cu; bandgap voltage reference circuit; but bow; circuit design; electrical measurement; high power automotive application; in line wafer bow; low power logic circuit; metallization; overvoltage capability; stress measurement; Atmospheric measurements; Particle measurements; Photonic band gap; Semiconductor device measurement; Voltage control; Voltage measurement;
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location :
Hong Kong
DOI :
10.1109/EDSSC.2013.6628233
