DocumentCode :
3478988
Title :
Evaluation of the effect of stress relief slots on QFN strip warpage using finite element analysis
Author :
Xiyun Cheng ; Lin Tan ; Qian Wang ; Jian Cai ; Honghui Wang ; Xiaojiang Wang ; Tonglong Zhang ; Shuidi Wang ; Jinrui Li
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
544
Lastpage :
546
Abstract :
QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages. Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced by molding process was simulated using finite element analysis (FEA). Effect of stress relief slots design of the leadframe was evaluated, and the influence of material properties was also studied with three different types of EMC (Epoxy Molding Compound). Simulation results indicated that CTE of the EMC had a considerable effect on the warpage direction and magnitude, and the existence of stress relief slots only slightly reduced warpage magnitude.
Keywords :
electronics packaging; finite element analysis; moulding; reliability; stress analysis; thermal expansion; CTE; EMC; FEA; QFN packaging process; QFN strip warpage; coefficient of thermal expansion; epoxy molding compound; finite element analysis; leadframe; molding process; quad flat no-lead packages; reliability; stress relief slot design; stress relief slot effect; Electromagnetic compatibility; Electronics packaging; Lead; Materials; Packaging; Stress; Strips; EMC; Finite Element Analysis; QFN; Stress Relief Slot; Warpage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756530
Filename :
6756530
Link To Document :
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