Flip chip CBGA package design and simulation

The Flip chip ceramic package, is a promising choice for high density integration applications such as CPU and FPGA. Excellent attributes of this advanced package include very good electrical performance and excellent thermal characteristics. In this paper, for a given die, we firstly designed a flip chip ceramic ball grid array package which has 675 I/O (1.0 mm pitch) in package design software, and then simulated the lumped resistance, inductance, capacitance and insertion loss of a differential signal pair in EM simulation software, respectively. Lastly, we simulated the thermal distribution and thermal resistance difference of the package with and without heat sink added in thermal simulation software. From the thermal simulation, we can see that adding a heat sink would decrease the thermal resistance effectively.