DocumentCode :
3479045
Title :
Cohesive zone modeling of mixed-mode delamination test
Author :
Bingbing Zhang ; Daoguo Yang ; Ernst, L.
Author_Institution :
Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
559
Lastpage :
565
Abstract :
Delamination is one of the main problems in electronic packaging due to the relatively weak adhesion strength of interfaces. In order to predict interface delamination the cohesive zone method is a possible tool. However, the correct choice of the cohesive parameters still forms an obstacle for general usage. In order to improve this, the present paper focuses on delamination modeling of delamination of an interface between Molding Compound and Copper lead frame as observed in preceding mixed mode bending tests. The choice of the cohesive zone parameters in relation to the active length of the cohesive zone, the mesh size and the crack propagation speed was first investigated by 2D modeling. Here the plane stress assumption was applied, as the test samples were quite narrow. Afterwards a symmetry half of the specimen was modeled, again combined with cohesive zone elements, to verity the plane stress condition. Simulation results of both the 2D and 3D models agree well with the experimental results.
Keywords :
delamination; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; 2D modeling; adhesion strength; cohesive parameters; cohesive zone method; cohesive zone parameters; copper lead frame; crack propagation speed; delamination modeling; electronic packaging; interface delamination; mixed mode bending tests; molding compound; plane stress condition; Delamination; Finite element analysis; Load modeling; Loading; Solid modeling; Stress; Three-dimensional displays; EMC-Copper lead frame; MMB test; cohesive zone method; delamination; mixed model;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756534
Filename :
6756534
Link To Document :
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