Hybrid modeling method for power integrity simulation and analysis of multilayer electronic packages

In this paper, an efficient hybrid modeling method is presented for power integrity analysis of multilayer printed circuit boards (PCBs) and advanced electronic packages, with multiple power-ground planes, multiple vias, and external loads such as decoupling capacitors. Each parallel-plate pair, which consists of two consecutive conductor plates functioning as either power or ground in the PCBs or packages, is modeled as 2D generalized transmission line equations (GTLE). Equivalent circuits are used to model the vias and external loads. Numerical validation reveals that the hybrid modeling method produces accurate simulation results with much less central processing unit time and memory requirements than 3-D full-wave approaches.