Title :
Chapter 4, Thermal mechanical behavior on wafer level
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location :
Brussels, Belgium
Print_ISBN :
0-7803-8420-2
DOI :
10.1109/ESIME.2004.1338166
