Software design on TSV-based three-dimensional interconnected

Author

Liu Huifen ; Miao Min ; Wang Xiaofei ; Ning Jianye ; Zuo Guoyi

Author_Institution

Inf. Microsyst. Instiute, Beijing Inf. Sci. & Technol. Univ., Beijing, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

617

Lastpage

621

Abstract

While System in package becomes the mainstream technology of integration package, it is investigated more and more. This paper introduces the research and development of software TSD based on System in package software of chip. Software TSD© (short for TSV Based Sip Designer) is combination simulation software which can draw Interposer model and chip, Interposer, TSV and PCB board. This software contains single and multiple TSV models. Parameter extraction and files storage can conduct simulation design of electromagnet and circuit by external interface.

Keywords

computer aided analysis; computer aided software engineering; multichip modules; printed circuit interconnections; printed circuit manufacture; system-in-package; three-dimensional integrated circuits; PCB board; TSV based sip designer; TSV models; TSV-based three-dimensional interconnected; external circuit interface; file storage; integration package; interposer chip; parameter extraction; software TSD; software design; system in package; Circuit simulation; Electromagnetics; Graphics; Integrated circuit modeling; Software; Solid modeling; Through-silicon vias; TSV; model rendering; simulation modeling; system SIP;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756545

Filename

6756545