Title :
Software design on TSV-based three-dimensional interconnected
Author :
Liu Huifen ; Miao Min ; Wang Xiaofei ; Ning Jianye ; Zuo Guoyi
Author_Institution :
Inf. Microsyst. Instiute, Beijing Inf. Sci. & Technol. Univ., Beijing, China
Abstract :
While System in package becomes the mainstream technology of integration package, it is investigated more and more. This paper introduces the research and development of software TSD based on System in package software of chip. Software TSD© (short for TSV Based Sip Designer) is combination simulation software which can draw Interposer model and chip, Interposer, TSV and PCB board. This software contains single and multiple TSV models. Parameter extraction and files storage can conduct simulation design of electromagnet and circuit by external interface.
Keywords :
computer aided analysis; computer aided software engineering; multichip modules; printed circuit interconnections; printed circuit manufacture; system-in-package; three-dimensional integrated circuits; PCB board; TSV based sip designer; TSV models; TSV-based three-dimensional interconnected; external circuit interface; file storage; integration package; interposer chip; parameter extraction; software TSD; software design; system in package; Circuit simulation; Electromagnetics; Graphics; Integrated circuit modeling; Software; Solid modeling; Through-silicon vias; TSV; model rendering; simulation modeling; system SIP;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756545
