DocumentCode
3479308
Title
Novel Room Temperature Wiring Process of Ag Nanoparticle Paste
Author
Wakuda, Daisuke ; Hatamura, Mariko ; Suganuma, Katsuaki
Author_Institution
Osaka Univ., Osaka
fYear
2007
fDate
Jan. 16 2007-Yearly 18 2007
Firstpage
110
Lastpage
113
Abstract
Ag nanoparticles protected by dodecylamine were formed into paste and successfully sintered at room temperature in air atmosphere. In order to remove the dodecylamine dispersant, Ag nanoparticles printed as lines on glass substrates were dipped in methanol for 10 s to 7200 s. As a result, the sintered wires possess excellent low resistivity, 7.3times10-7 Omegam after 7200 s dipping. From in-situ electrical resistance measurement, the electrical resistance of Ag nanoparticles becomes smaller as sintering time increases. Microstructural observation on room temperature sintering revealed that, as dipping time increases, Ag nanoparticles agglomerate to be coarsened, and connection among particles becomes clearer. Thus, a novel room temperature wiring method for Ag nanoparticles has been successfully developed in air atmosphere.
Keywords
electrical resistivity; nanoparticles; silver; sintering; wiring; Ag nanoparticle paste; dipping time; dodecylamine dispersant; in-situ electrical resistance measurement; methanol; microstructural observation; resistance 7.3 muohm; room temperature sintering; room temperature wiring process; time 10 s to 7200 s; Atmosphere; Conductivity; Electrical resistance measurement; Glass; Methanol; Nanoparticles; Protection; Temperature; Wires; Wiring; Nanoparticle; Room Temperature; Silver; Sintering;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location
Odaiba, Tokyo
Print_ISBN
978-1-4244-1186-3
Electronic_ISBN
978-1-4244-1186-3
Type
conf
DOI
10.1109/POLYTR.2007.4339149
Filename
4339149
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