Numerical simulations based thermal reliability of power device packages

Author

Kailong Yang ; Xueyin Zhang ; Ming Li ; Ming Chen ; Liming Gao

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

635

Lastpage

641

Abstract

Discrete high power packages: TO-220FP, TO-247, TO-3P are investigated for their thermal-mechanical behaviors. Junction-to-ambient thermal resistance measurements and Computational Fluid Dynamics (CFD) simulations are utilized to judge the thermal performance of these packages with the same material properties. The finite element method (FEM) simulations of temperature cycling is also applied to analyze the internal stress and strain, impact of different die size and thickness have been compared, which provides references for further studies and power packages optimization.

Keywords

circuit reliability; computational fluid dynamics; electronics packaging; finite element analysis; optimisation; stress analysis; stress-strain relations; thermal resistance measurement; thermal stresses; CFD simulation; FEM; TO-220FP; TO-247; TO-3P; computational fluid dynamics simulation; finite element method; internal stress analysis; junction-to-ambient thermal resistance measurement; material property; numerical simulation; optimization; power device packaging; strain analysis; temperature cycling simulation; thermal reliability; thermal-mechanical behavior; Electromagnetic compatibility; Electronic packaging thermal management; Strain; Temperature; Temperature measurement; Thermal resistance; numerical sumulation; power packages; temperature cycling; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756549

Filename

6756549