DocumentCode
3479461
Title
Chapter 8, Thermal behavior modeling and characterization
fYear
2004
fDate
10-12 May 2004
Firstpage
175
Lastpage
175
Abstract
Start of the above-titled section of the conference proceedings record.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location
Brussels, Belgium
Print_ISBN
0-7803-8420-2
Type
conf
DOI
10.1109/ESIME.2004.1338176
Filename
1338176
Link To Document