Title :
Recent Trend of Optical Circuit Board in Taiwan
Author :
Lee, Shin-Ge ; Lee, Chun-Hsing ; Lu, Chien Chun ; Cheng, Fu-Yi ; Shen, Kun-Yi ; Huang, Sheng-Ho ; Shen, Li-Cheng ; Chang, Shu-Ming ; Chang, Hsiang-Hung ; Fu, Huan-Chun ; Tien, Pei ; Chu, Mu-Tao ; Chan, Yi-Jen
Author_Institution :
Ind. Technol. Res. Inst., Hsinchu
fDate :
Jan. 16 2007-Yearly 18 2007
Abstract :
Optical interconnects (OI) prove ways to overcome the high power consumption, large footprint, high integration density, signal latency and skew issues at high speed data transmission. In this paper, the research accomplishments of optical polymer waveguide, high speed optoelectronic packages, rigid and flexible optoelectronic printed circuit board (OEPCB) for high speed board to board, and chip to chip optical interconnects develop in Taiwan have demonstrated and discussed.
Keywords :
integrated optoelectronics; optical interconnections; optical polymers; optical waveguides; printed circuits; OEPCB; Taiwan; high speed optoelectronic packages; optical circuit board; optical interconnects; optical polymer waveguide; optoelectronic printed circuit board; Data communication; Delay; Energy consumption; Flexible printed circuits; High speed optical techniques; Optical interconnections; Optical polymers; Optical waveguides; Packaging; Printed circuits; Polymer waveguide; optical interconnect; optoelectronic printed circuit board;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location :
Odaiba, Tokyo
Print_ISBN :
978-1-4244-1186-3
Electronic_ISBN :
978-1-4244-1186-3
DOI :
10.1109/POLYTR.2007.4339163
