Title :
Present and Future Directions for Multichip Module Technologies
Author_Institution :
Semiconductor Device Engineering Laboratory, Toshiba Corp.
Keywords :
Ceramics; Costs; Microprocessors; Multichip modules; Packaging; Semiconductor thin films; Sputtering; Substrates; Thin film circuits; Very large scale integration;
Conference_Titel :
VLSI Circuits, 1994. Digest of Technical Papers., 1994 Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-7803-1918-4
DOI :
10.1109/VLSIC.1994.586210
