DocumentCode
3479649
Title
Study on volume production of uniform wafer-level micro glass cavities by a chemical foaming process (CFP)
Author
Yu Zou ; Jintang Shang ; Yu Ji ; Li Zhang ; Chiming Lai ; Dong Chen ; Kim-Hui Chen
Author_Institution
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
711
Lastpage
715
Abstract
In this paper, an improved chemical foaming process (CFP) for wafer-level glass cavities will be demonstrated for volume production in a clean room. First of all, suitable foaming agents transferring techniques are investigated to avoid powder pollution to the chips in a clean room. In addition, the precise controlling of the sizes of the glass cavities is studied theoretically and experimentally. The shapes, morphology and sizes of the glass cavities formed by the improved CFP are characterized by AFM and digital 3D microscopy. A theoretical model for precisely predicting the final shapes and sizes are established. Moreover, glass cavities with uniform structures and precisely controlled sizes at a 4-inch wafer are prepared successfully. The improved CFP will provide a novel volume-production technique for micro-machining of glass, which has many applications in MEMS and MOEMS.
Keywords
glass; microcavities; micromachining; wafer level packaging; AFM; MEMS; MOEMS; chemical foaming process; digital 3D microscopy; foaming agents transferring techniques; micromachining; powder pollution; uniform wafer level micro glass cavities; volume production technique; Cavity resonators; Chemicals; Glass; Micromechanical devices; Packaging; Production; Silicon; CFP; glass cavitiies; micro-machining; volume-production; wafer-level;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756565
Filename
6756565
Link To Document