Title :
Three-dimensional X-ray laminography and application in failure analysis for System in Package (SiP)
Author :
Yuan Chen ; Na Lin
Author_Institution :
Electron. Inst., Sci. & Technol. of Reliability Phys. & Applic. of Electron. Component Lab., MII, Guangzhou, China
Abstract :
System in Package (SiP) technology is rapidly evolved from specialty technology used in a narrow set of applications to a high volume technology with wide ranging impact on electronics markets. Numerous concepts for three dimensional (3D) SiP packaging are now emerging driven largely by the demands of portable consumer products. Conventional failure analysis techniques face a great challenge for SiP devices. 3D X-Ray technique can capture three-dimensional information about the internal structure of an object. It is very useful for 3D SiP failure analysis. This paper introduced the technology and methodology of 3D X-Ray Inspection with Computed Tomography. And 3D X-Ray analysis methods aiming at the structure and process characteristics of SiP were discussed. A case using 3D X-Ray technique analyzing a SiP sample was presented.
Keywords :
X-ray microscopy; computerised tomography; consumer electronics; electronic engineering computing; failure analysis; inspection; system-in-package; 3D SiP packaging; 3D X-ray analysis method; 3D X-ray inspection methodology; computed tomography; electronics market; failure analysis technique; portable consumer product; system in package technology; three dimensional SiP packaging; three-dimensional X-ray laminography; Computed tomography; Failure analysis; Image reconstruction; Inspection; Soldering; Three-dimensional displays; X-ray imaging; Computed Tomography; Failure Analysis; System in Package; X-Ray;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756573
