Title :
Advanced Low-Dielectric Constant Packaging Materials With Compatible Conductors
Author :
Stein, S.J. ; Wahlers, R.L. ; Sykora, G.
Author_Institution :
Electro-Science Laboratories
Abstract :
A thick film material, ESL D-4911-S, has been developed which supplies the requisite surface for fine pitch conductors and a low dielectric constant to minimize crosstalk and signal delay. Predictable results were obtained when the D-4911-S was combined with another thick film dielectric to form composite structures. Line resolution of 25 microns or smaller were obtained with ESL D-8084 metallo-organic gold using photoresist/etch processing.
Keywords :
Composite materials; Conducting materials; Conductive films; Dielectric constant; Dielectric materials; Dielectric measurements; Dielectric substrates; Gold; Packaging; Testing;
Conference_Titel :
Electro International, 1991
Conference_Location :
New York, NY, USA
DOI :
10.1109/ELECTR.1991.718214
