Title :
Shear strength and brittle failure of low-Ag SAC-Bi-Ni solder joints during ball shear test
Author :
Liu Yang ; Sun Fenglian ; Yang Miaosen
Author_Institution :
Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
Abstract :
This paper investigated the shear strength and failure mechanism of low-Ag SAC-BiNi solder joints in comparison with SAC0705 and SAC305 solder joints. Experimental results demonstrated that the shear strength of SAC0705-BiNi/Cu solder joint was higher than SAC0705/Cu and SAC305/Cu solder joints before and after HTS aging. Moreover, SAC0705-BiNi/Cu solder joint has the smallest IMC grains and the highest resistance for the spread of shear crack in the three kinds of solder joints after reflow. After HTS aging, the interfacial microstructure of the investigated solder joints coarsened and the shear strength of these solder joints decreased. In SAC0705/Cu and SAC305/Cu solder joints, the failure of the solder joints is due to the ductile fracture of the bulk solder of the solder joints and the brittle broken of the individual large IMC grains. Meanwhile, the failure of SAC0705-BiNi/Cu is mostly because of the broken of interfacial IMC and the separation between IMC and the bulk solder of the solder joins.
Keywords :
bismuth alloys; copper alloys; cracks; ductile fracture; electronics packaging; nickel alloys; shear strength; silver alloys; solders; testing; tin alloys; HTS aging; SnAgCu-BiNi; ball shear test; brittle failure; bulk solder; ductile fracture; interfacial microstructure; shear crack; shear strength; solder joints; Aging; Electronics packaging; High-temperature superconductors; Metals; Morphology; Soldering; Sn-Ag-Cu (SAC); brittle failure; intermetallic compounds (IMC); low-Ag;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756574
