Title :
Metal Insulator Structures For Multichip Modules
Author_Institution :
Georgia Institute of Technology
Abstract :
The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.
Keywords :
Adhesives; Chemical technology; Costs; Dielectrics and electrical insulation; Metal-insulator structures; Microstrip; Multichip modules; Packaging; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electro International, 1991
Conference_Location :
New York, NY, USA
DOI :
10.1109/ELECTR.1991.718215
