Title :
The GHz region characteristic of the BGA-printed wired board interconnection by conductive adhesives
Author :
Otsuka, Kanji ; Akiyama, Yutaka
Author_Institution :
Meisei Univ., Tokyo
fDate :
Jan. 16 2007-Yearly 18 2007
Abstract :
It is research of a part of NEDO project "High temperature solder substitution/electric conductive adhesives development." BGA by FR-4 and printed wired board by FR-4 were connected using first development article XA-5554 of silver and epoxy electric conduction adhesives,the 5GHz (10Gbps) input signal in BGA was examined. And the high frequency signal and power supply characteristics of the conductive adhesives were measured. Differential signal of 10Gbps into the connections which it passed through eight daisy chains, power carried out perfectly for 10Gbps operation. Also the actual driver system which power connection passed through eight daisy chains, operated 3Gbps. As the conclusion, it was clarified that the first trial product has a high-speed signal transmission performance enough.
Keywords :
ball grid arrays; conductive adhesives; interconnections; printed circuits; BGA-printed wired board interconnection; FR-4; ball grid arrays; bit rate 10 Gbit/s; bit rate 3 Gbit/s; conductive adhesives; frequency 5 GHz; power integrity; printed wired board; signal integrity; solder substitution; Conductive adhesives; Conductivity measurement; Frequency measurement; Integrated circuit interconnections; Power measurement; Power supplies; Silver; Temperature; Testing; Wiring; Conductive adhesives; Power integrity for conductive adhesive; Signal integrity for conductive adhesive;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location :
Odaiba, Tokyo
Print_ISBN :
978-1-4244-1186-3
Electronic_ISBN :
978-1-4244-1186-3
DOI :
10.1109/POLYTR.2007.4339182
