DocumentCode :
3479937
Title :
Elastic and Conformable Electronic Circuits and Assemblies using MID in polymer
Author :
Axisa, F. ; Brosteaux, D. ; De Leersnyder, E. ; Bossuyt, F. ; Gonzalez, M. ; Bulcke, Vanden M. ; Vanfleteren, J.
Author_Institution :
lMEC/TFCG Microsyst., Ghent
fYear :
2007
fDate :
Jan. 16 2007-Yearly 18 2007
Firstpage :
280
Lastpage :
286
Abstract :
For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the initial results of an MID (moulded interconnect device) technology will be presented, showing the feasibility of functional stretchable electronic circuits. In the developed technology rigid or flexible standard components are interconnected by meander shaped electroplated metallic wires and embedded by molding in a stretchable substrate polymer, like silicone rubber or polyurethane. The meander design was supported by mechanical simulations in order to minimize the stress in the metal during deformation. In this way reliable stretchability of the circuits above 100% has been demonstrated. A simple stretchable thermometer circuit with 4 components embedded in Dow Corning Silasticreg PDMS silicone material has been built and proper operation has been demonstrated.
Keywords :
conducting polymers; flexible electronics; integrated circuit interconnections; prosthetics; thermometers; wearable computers; Dow Corning Silastic; PDMS silicone material; biomedical system; conductive polymer; conformable electronic circuit; elastic electronic circuit; human body implantation; meander design; moulded interconnect device; self-healing structure; smart clothes; stretchable electronic circuits; stretchable thermometer circuit; Assembly; Circuit simulation; Deformable models; Electronic circuits; Humans; Integrated circuit interconnections; Polymers; Rubber; Standards development; Wires; MID; Stretchable electronics; biomedical system; conductive polymer; electroplating; meander; self-healing structure;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location :
Odaiba, Tokyo
Print_ISBN :
978-1-4244-1186-3
Electronic_ISBN :
978-1-4244-1186-3
Type :
conf
DOI :
10.1109/POLYTR.2007.4339183
Filename :
4339183
Link To Document :
بازگشت