Title :
Heat -Resistant, Self-Releasing Tape And Its Application
Author_Institution :
Sekisui Chemical Co. Ltd., Tokyo
fDate :
Jan. 16 2007-Yearly 18 2007
Abstract :
We have developed Self-releasing Adhesive Tape ldquoSELFArdquo for manufacturing of ultra thin semiconductor wafers. With this adhesive tape, the semiconductor wafer is fixed and supported properly on glass board. After ultra thin grinding process and other processes, glass board starts self-releasing with UV irradiation. This tape guarantees ultra thin wafers are safely handled by Glass Wafer Support System (GWSS) in some treatment process. This report states the basic self-releasing mechanism and the characteristics of SELFA and the applications to an ultra thin manufacturing system for semiconductor wafers.
Keywords :
adhesives; tape automated bonding; wafer-scale integration; SELFA; UV irradiation; glass board; glass wafer support system; heat-resistant; self-releasing adhesive tape; ultra thin manufacturing system; ultra thin semiconductor wafers; Chemicals; Circuit stability; Glass; Heat treatment; Manufacturing systems; Resistance heating; Semiconductor device manufacture; Surface treatment; Temperature; Thermal resistance; Glass Wafer Support System (GWSS); heat resistance; self-releasing tape;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location :
Odaiba, Tokyo
Print_ISBN :
978-1-4244-1186-3
Electronic_ISBN :
978-1-4244-1186-3
DOI :
10.1109/POLYTR.2007.4339185
