Heat -Resistant, Self-Releasing Tape And Its Application

Author

Hasegawa, Akio

Author_Institution

Sekisui Chemical Co. Ltd., Tokyo

fYear

2007

fDate

Jan. 16 2007-Yearly 18 2007

Firstpage

290

Lastpage

292

Abstract

We have developed Self-releasing Adhesive Tape ldquoSELFArdquo for manufacturing of ultra thin semiconductor wafers. With this adhesive tape, the semiconductor wafer is fixed and supported properly on glass board. After ultra thin grinding process and other processes, glass board starts self-releasing with UV irradiation. This tape guarantees ultra thin wafers are safely handled by Glass Wafer Support System (GWSS) in some treatment process. This report states the basic self-releasing mechanism and the characteristics of SELFA and the applications to an ultra thin manufacturing system for semiconductor wafers.

Keywords

adhesives; tape automated bonding; wafer-scale integration; SELFA; UV irradiation; glass board; glass wafer support system; heat-resistant; self-releasing adhesive tape; ultra thin manufacturing system; ultra thin semiconductor wafers; Chemicals; Circuit stability; Glass; Heat treatment; Manufacturing systems; Resistance heating; Semiconductor device manufacture; Surface treatment; Temperature; Thermal resistance; Glass Wafer Support System (GWSS); heat resistance; self-releasing tape;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on

Conference_Location

Odaiba, Tokyo

Print_ISBN

978-1-4244-1186-3

Electronic_ISBN

978-1-4244-1186-3

Type

conf

DOI

10.1109/POLYTR.2007.4339185

Filename

4339185