DocumentCode
3479982
Title
Chapter 16, Solder reliability behavior
fYear
2004
fDate
10-12 May 2004
Firstpage
435
Lastpage
435
Abstract
Start of the above-titled section of the conference proceedings record.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location
Brussels, Belgium
Print_ISBN
0-7803-8420-2
Type
conf
DOI
10.1109/ESIME.2004.1338206
Filename
1338206
Link To Document