Growth of Cu-Sn intermetallic compounds during isothermal aging processing in electroplated Cu/Sn/Cu system

Author

Na Huang ; Anmin Hu ; Ming Li

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

781

Lastpage

783

Abstract

Microstructure evolutions of as-reflowed and aged electroplated Cu/Sn/Cu sandwich structure with 20 or 40μm Sn layer have been investigated. Cu₃Sn was observed at lower side of Cu/Sn/Cu structure with 40μm Sn layer after isothermal aging treatment for 24 hours, as for that structure with 20μm Sn layer, Cu₃Sn appeared after aging for 48 hours. Regardless of Sn volume, the thickness of the blanket Cu₆Sn₅ and total intermetallic compounds (Cu₆Sn₅+Cu₃Sn) increased linearly with the increasing aging time. After long-time aging processing, the layers of blanket Cu₆Sn₅ and Cu₃Sn in the the Cu/Sn/Cu structure with 20μm Sn layer are both thicker. Volume of Sn layer has significant effect on the growth of Cu-Sn IMCs in the electroplated Cu/Sn/Cu system.

Keywords

ageing; copper alloys; electroplating; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; tin alloys; Cu-Sn-Cu; isothermal aging process; isothermal aging treatment; long time aging processing; microstructure evolutions; sandwich structure; total intermetallic compound; Aging; Copper; Isothermal processes; Microstructure; Soldering; Substrates; Tin; IMCs; microstructure; olume effect;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756581

Filename

6756581