The reliability study of a high density multi chip packaging with folding flexible substrate

Author

Wen Yin ; Bo Zhang ; Yuan Lu ; Liao Anmou ; Du Tianmin ; Shangguan Dongkai

Author_Institution

Nat. Center for Adv. Packaging, Wu Xi, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

835

Lastpage

838

Abstract

This paper presents a multichip stack packaging based on flexible substrate. In this structure, three dummy chips with daisy chain test circuit were flip-chip bonded on a double-layer non-gel flexible substrate, then a 3D packaging were made by folding process. The dimension of the 3D package after folding was about 6×6.6×1.3mm³. The dimension was mainly confined by the dimension of dummy chips. To test the structure and process, some electrical measurements was taken. And the main reliability problem of a flexible package was investigated through a series of reliability tests.

Keywords

flexible electronics; integrated circuit reliability; multichip modules; substrates; three-dimensional integrated circuits; 3D packaging; daisy chain test circuit; double-layer nongel flexible substrate; dummy chips; flexible package; flip-chip bonded; folding process; main reliability problem; multichip stack packaging; reliability tests; Encapsulation; Flexible printed circuits; Reliability; Substrates; Three-dimensional displays; 3D stacking; Flexible substrate; Packaging Materials & Processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756593

Filename

6756593