Title :
Mechanical property and reliability of anisotropic conductive adhesive in surface mount applications
Author :
Huang Lin ; Zhou Liangjie ; Liu Hui ; Wu Fengshun ; Xia Weisheng ; Fu Hongzhi ; Wang Shiyu ; Liu Zhe
Author_Institution :
Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
Anisotropic conductive adhesive (ACA) offers a promising solution for fine-pitch interconnections, which is low cost, low temperature and environmentally clean. Good mechanical property and high reliability are both required for ACAs to be an alternative of solders. In this study, three types of ACAs and one lead-free solder were selected to investigate their mechanical properties and reliabilities. Shear strength test was conducted to study the mechanical property of the samples. Reflow test was performed to examine if the ACA could be compatible with SMT process, and the shock resistance was studied by the drop test. In addition, the temperature cycling test (-40 °C to 125 °C) and the 85 °C /85% RH thermal humidity storage test were conducted to study the reliability.
Keywords :
circuit reliability; conductive adhesives; mechanical properties; printed circuit interconnections; surface mount technology; SMT process; anisotropic conductive adhesive reliability; fine pitch interconnection; mechanical properties; mechanical property; shear strength test; solder alternative; surface mount applications; temperature -40 C to 125 C; temperature cycling test; Conductive adhesives; Joints; Mechanical factors; Reliability; Substrates; Temperature measurement; Anisotropic conductive adhesive; Mechanical property; Reliability;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756594
