DocumentCode
3480467
Title
Fracture mode of the IMC layer in soder joints
Author
Wang Xuming ; Qin Fei ; An Tong
Author_Institution
China Electr. Power Res. Inst., Beijing, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
861
Lastpage
864
Abstract
Tensile specimens with a Cu/IMC/solder/IMC/Cu structure were prepared, and were treated by 0h, 72h, 168h, 288h, 500h, 1000h isothermal aging processing at 150°C. Quasi-static tensile tests were conducted on the micro-tester Instron5948, Fracture analysis of fractured specimens was conducted by optical microscopy and scanning electron microscopy. Two fracture modes were found, and the fracturing surface tends to be flat with the aging time increases.
Keywords
copper alloys; electronics packaging; fracture; solders; tensile testing; Cu; IMC layer; electronic package; fracture mode; fractured specimen analysis; isothermal aging processing; microtester Instron5948; optical microscopy; quasistatic tensile tests; scanning electron microscopy; soder joints; temperature 150 degC; time 0 h; time 100 h; time 168 h; time 288 h; time 500 h; time 72 h; Aging; Compounds; Intermetallic; Materials; Scanning electron microscopy; Soldering; IMC; electronic package; fracture mode; lead-free solder;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756599
Filename
6756599
Link To Document