A study on reliability of chip scale packages in shock environments

Author

Shuai Chen ; Lei Wang ; Mingxia Jiang ; Jieying Tang

Author_Institution

Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

921

Lastpage

924

Abstract

The paper reports compare of reliability between the chip scale package in MEMS devices with internal support structures and those without internal support structures in shock environments. We choose two kinds of chip scale packages of MEMS devices that meet requirements of analysis and experimental. By means of experiments, we obtained two kinds of chip scale packages structural parameters. And we establish structural model by ANSYS. The FEM (Finite Element Method) simulation and experimental test on both kinds of chip scale packages were performed. The improvement of shock resistance of chip scale package with internal support structures is demonstrated according to our results.

Keywords

chip scale packaging; finite element analysis; impact (mechanical); micromechanical devices; ANSYS structural model; FEM; MEMS devices; chip scale packages; finite element method; internal support structures; reliability; shock environments; shock resistance; Electric shock; Finite element analysis; Micromechanical devices; Performance evaluation; Reliability; Strain; Stress; FEM; chip scale packages; reliability; shock environment; support structures;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756611

Filename

6756611