Sensitivity study on a MEMS inclinometer with different packaging thickness

The MEMS Si thermal convective inclinometer without solid proof mass has many advantages such as more robust and immune to vibration shocks compared with traditional inclinometer. In this paper, a 3D parametric model of this kind of inclinometer has been setup. The influences of different airflow velocity under high environmental temperature have also been considered to study how they affect the sensitivity of this inclinometer. The results show that package can decrease the influence of environmental temperature to the inclinometer. At the environmental temperature of 70 °C, when the airflow velocity reaches to 1.7cm/s, package thickness about 1mm is enough to guarantee inside temperature distribution the same as the windless condition. But if airflow velocity rises to 2cm/s, the package thickness should be increased to 2mm, and this thickness reaches to its maximum for MEMS package in application.