Title :
Dynamic characterization of fiber glass reinforced epoxy plate using OMA for damage detection
Author :
Rahman, Haizuan Abd ; Isa, Ahmad Azlan Mat ; Alias, Siti Khadijah ; Latip, Syazuan Abdul
Author_Institution :
Fac. of Mech. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
Abstract :
Composite materials with nonlinear properties are proned to subsurface damages such as core crack, delamination, etc., that are difficult to detect visually. Even though vibration response as damage detection method is widely used in engineering applications, its usage is to nonlinear and nonhomogenous properties especially in composite materials is still limited. This paper attempts to apply vibration based damage detection method specifically operational modal analysis (OMA) on fiber glass reinforced epoxy plate. OMA is used on undamaged fiber glass reinforced epoxy plate to extract the dynamic parameters and after which the procedure is extended to damage fiber glass reinforced epoxy plate. Both and damaged composite material are tested for different boundary conditions i.e. free-free on 4 edges, 1 edge clamped, 2 edges clamped, 3 edges clamped and 4 edges clamped condition. Results of these experimental setups will be compared to establish modal parameters on undamaged and damaged composites plate.
Keywords :
cracks; delamination; glass fibre reinforced composites; materials testing; plates (structures); vibrations; core crack; damage detection method; damage fiber glass reinforced epoxy plate; damaged composite material testing; delamination; dynamic characterization; dynamic parameter extraction; engineering application; nonhomogenous property; nonlinear property; operational modal analysis; subsurface damage; undamaged fiber glass reinforced epoxy plate; vibration response; Boundary conditions; Composite materials; Damping; Frequency domain analysis; Glass; Shape; Vibrations; Composite Material; Damage Detection; Operational Modal Analysis; Vibration;
Conference_Titel :
Humanities, Science and Engineering (CHUSER), 2011 IEEE Colloquium on
Conference_Location :
Penang
Print_ISBN :
978-1-4673-0021-6
DOI :
10.1109/CHUSER.2011.6163735