DocumentCode :
3481345
Title :
Medium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics
Author :
De Geyter, N. ; Morent, R. ; Axisa, F. ; De Smet, N. ; Gengembre, L. ; De Leersnijder, E. ; Leys, C. ; Vanfleteren, J. ; Rymarczyk-Machal, M. ; Schacht, E. ; Payen, E.
Author_Institution :
Dept. of Appl. Phys., Ghent Univ., Ghent
fYear :
2008
fDate :
17-20 Aug. 2008
Firstpage :
1
Lastpage :
3
Abstract :
Stretchable electronics consist of a stretchable substrate material with embedded electronic components connected by electronic interconnections. Since little or no stretchable electronic components are available, it is vital to engineer electronic interconnections which are stretchable. Today metals (copper, nickel and gold) are the best option to realize the interconnections with high performance and low cost. However, metals are not intrinsically stretchable, therefore, a suitable design such as a meander-shaped horseshoe structure is necessary. This structure can be reproducibly stretched and released many times without breaking. Among the identified stretchable substrate materials appropriate for the fabrication of implantable electronic systems, polydimethylsiloxane (PDMS) is one of the most promising due to its specific mechanical properties (compliance, softness) and its good biocompatibility.
Keywords :
adhesion; flexible electronics; integrated circuit interconnections; plasma materials processing; PDMS adhesion; atmospheric pressure plasma treatment; electronic interconnections; embedded electronic components; flexible and stretchable electronics; implantable electronic systems; meander-shaped horseshoe structure; polydimethylsiloxane; stretchable electronics; stretchable substrate material; Adhesives; Atmospheric-pressure plasmas; Biological materials; Copper; Costs; Electronic components; Fabrication; Gold; Nickel; Plasma materials processing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on
Conference_Location :
Garmish-Partenkirchen
Print_ISBN :
978-1-4244-2141-1
Electronic_ISBN :
978-1-4244-2142-8
Type :
conf
DOI :
10.1109/PORTABLE-POLYTRONIC.2008.4681279
Filename :
4681279
Link To Document :
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