Research on peel strength of flexible copper clad laminate

With the rapid development of the electronic industry, electronic products tend to be small, lightweight and high density, the demand of flexible copper clad laminate (FCCL) is increasing every year. Peel strength is a key property for FCCL. This paper studies the effect of heat/humidity treatment on the adhesion strength of FCCL. The results show that the original peel strength of FCCL was high in the middle and low on both sides of the sample. The heat/humidity treatments played a strong role in promoting uniform of peel strength. The peel strength of FCCL after 85%RH/85^oC treatment was higher than that after 85^oC heat treatment. As time increases, the peel strength decreased. This paper gives its explanations for the phenomena.