Title :
Transverse cracking in viscoelastic bounded assembles
Author :
Ingman, D. ; Suzdalnitsky, J.
Abstract :
A problem of crack stability in assembles of bi-layers, with a viscoelastic bonding interface is analyzed. Two approaches are used to describe the phenomena: classical fracture mechanics and viscoelastic partial derivative operator. The impact of the viscoelasticity on the stress intensity factor is evaluated for various structural physical and geometric parameters. The crack state for both upper and lower assembly layers, one metallic and the other viscoelastic, is considered.
Keywords :
cracks; fracture mechanics; viscoelasticity; classical fracture mechanics; crack stability; geometric parameters; stress intensity factor; transverse cracking; viscoelastic bonding interface; viscoelastic bounded assembles; viscoelastic partial derivative operator; Assembly; Elasticity; Plastics; Semiconductor device packaging; Semiconductor materials; Soldering; Strips; Substrates; Thermal stresses; Viscosity;
Conference_Titel :
Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on
Conference_Location :
Garmish-Partenkirchen
Print_ISBN :
978-1-4244-2141-1
Electronic_ISBN :
978-1-4244-2142-8
DOI :
10.1109/PORTABLE-POLYTRONIC.2008.4681285
