Synthesis of Ag nanorods and application to soft die attaching

In this paper, we report the synthesis of Ag nanoparticles paste, a new bonding agent using between chips and substrates in semiconductor devices. Ag nanorods with varied yield have been successfully synthesized by simply adjusting the concentration of additive salt, the moral ratio of capping agent to AgNO₃. The Ag nanoparticles can be sintered to form porous die attach layer between chip and substrates. The performance of Ag die attach layer has been discussed by electrical conductibility, and strength measurements.