Title :
Application of construction analysis in MMIC device intrinsic reliability evaluating
Author :
Liu Xin ; Fang Wenxiao
Author_Institution :
Fifth Res. Inst., Sci. & Technol. of Reliability Phys. & Applic. of Electron. Component Lab., MIIT, Guangzhou, China
Abstract :
Construction analysis, as a new evaluation method on reliability, is applied in engineering on the intrinsic reliability of electronic components´ reliability evaluating. In this article, the contents and procedure of construction analysis are discussed in detailed, with the help of an example of monolithic microwave integrated circuits. This provides a new evaluation method of electronic components in quality testing and reliability control.
Keywords :
MMIC; integrated circuit reliability; MMIC device intrinsic reliability evaluation method; construction analysis procedure; electronic component intrinsic reliability; monolithic microwave integrated circuits; quality testing; reliability control; Electronic components; Encapsulation; Integrated circuit reliability; MMICs; Materials; Reliability engineering; Construction analysis (CA); Evaluating; MMIC; Procedure; Reliability;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756644
