DocumentCode :
3481525
Title :
High thermal conductive underfill materials for flip-chip application
Author :
Liang, Qizhen ; Moon, Kyoung-Sik ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA
fYear :
2008
fDate :
17-20 Aug. 2008
Firstpage :
1
Lastpage :
4
Abstract :
Hexagonal boron nitride (h-BN) was applied as a thermally conductive filler to increase the thermal conductivity of underfills. This paper is focusing on the relationship between the filler morphology and its effects on the thermal conductivity. In this study, two kinds of h-BN fillers with different morphologies were applied to generate an efficient thermal transfer path through the filler and epoxy resin interfaces. The microstructure, the dynamic mechanical properties and thermal conductivity for the h-BN filled underfills were characterized. The h-BN greatly increased the thermal conductivity of the underfill and their moduli were well controlled in a low level which can be greatly helpful to reduce thermal stress in flip-chip application.
Keywords :
boron; flip-chip devices; polymers; thermal conductivity; thermal stresses; dynamic mechanical properties; epoxy resin interfaces; filler morphology; flip-chip application; hexagonal boron nitride; high thermal conductive underfill materials; thermal stress reduction; thermal transfer path; thermally conductive filler; Boron; Conducting materials; Copper; Materials reliability; Materials science and technology; Microstructure; Morphology; Thermal conductivity; Thermal engineering; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on
Conference_Location :
Garmish-Partenkirchen
Print_ISBN :
978-1-4244-2141-1
Electronic_ISBN :
978-1-4244-2142-8
Type :
conf
DOI :
10.1109/PORTABLE-POLYTRONIC.2008.4681290
Filename :
4681290
Link To Document :
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