DocumentCode
3481588
Title
From fuzziness to robustness - a multi-filament fiber model
Author
Manor, Erez
Author_Institution
QA&R unit, Technion - Israel Inst. of Technol., Haifa
fYear
2008
fDate
17-20 Aug. 2008
Firstpage
1
Lastpage
7
Abstract
Whiskers or fibers can contribute to the strength of bonding layers of electronic and opto-electronic packaging. A model of polymeric bonding layer containing fibers is studied. The reliability of filaments, such as carbon whiskers or nano-tubes, under tensile stress, is characterized by a strength probability distribution with high variance, leading to reliability fuzziness. One of quality engineeringpsilas goals is to minimize such fuzziness. Splitting the whisker into numerous smaller whiskers reaches this goal. The intact state becomes multi-state instead of single-state, where complete failure happens when all small whiskers fail. Such multi-state introduces fuzziness into the reliability state of the fiber. We show the increase in internal failure fuzziness reduces the overall reliability fuzziness. Analytical and simulation results demonstrate two special modes of loading: static loading, in which whiskers collapse sequentially under one load, and dynamic loading by repetitive shocks (load pulses) that cause aging of the fiber. The conclusion is that division into smaller whiskers may weaken the fiber but reduce the reliability fuzziness.
Keywords
adhesive bonding; electronics packaging; fuzzy set theory; reliability; filaments reliability; internal failure fuzziness; multifilament fiber model; opto-electronic packaging; polymeric bonding layer; reliability fuzziness; static loading; strength probability distribution; tensile stress; Aging; Analytical models; Bonding; Electric shock; Electronics packaging; Polymers; Probability distribution; Reliability engineering; Robustness; Tensile stress; Material Reliability; Packaging; Reliability Modeling; Simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on
Conference_Location
Garmish-Partenkirchen
Print_ISBN
978-1-4244-2141-1
Electronic_ISBN
978-1-4244-2142-8
Type
conf
DOI
10.1109/PORTABLE-POLYTRONIC.2008.4681293
Filename
4681293
Link To Document