• DocumentCode
    3481692
  • Title

    Minimizing the drawing stages of a Bracket Assembly Upper Spring using DYNAFORM

  • Author

    Salleh, Farrahshaida Mohd ; Tharazi, Izdihar ; Omar, Abdul Rahman ; Jaafar, Roseleena ; Rahman, Wan Emri Wan Abdul

  • Author_Institution
    Fac. of Mech. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
  • fYear
    2011
  • fDate
    5-6 Dec. 2011
  • Firstpage
    358
  • Lastpage
    363
  • Abstract
    This research work deals with the formability of sheet metal parts that depends very much on material properties, machine and process parameters, and part geometry. It provides an insight into drawing of low carbon steel axis-symmetrical cylindrical cup known as Bracket Assembly Upper Spring using DYNAFORM in order to reduce the current four draw stages. The simulation process is analyzed through finite element analysis (FEA) solution that generates the forming limit diagram (FLD) of the part as well as the stress, strain and thickness results. In this paper, the results of the optimization process showed that the risk of the part to form cracks is lesser than the actual part produced by the company. The percentage away from the failure zone of the FLD is higher than the current draw stages. In addition, the minimum thickness of the part produced is still within the acceptable quality control limits.
  • Keywords
    assembling; cracks; failure (mechanical); finite element analysis; optimisation; quality control; sheet metal processing; springs (mechanical); steel; DYNAFORM; bracket assembly upper spring; cracks; failure zone; finite element analysis; forming limit diagram; low carbon steel axis-symmetrical cylindrical cup; optimization; quality control; sheet metal parts formability; Assembly; Flanges; Materials; Metals; Optimization; Springs; Strain; DYNAFORM; Forming Limit Diagram (FLD); cup drawing; sheet metal formability; thickness distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Humanities, Science and Engineering (CHUSER), 2011 IEEE Colloquium on
  • Conference_Location
    Penang
  • Print_ISBN
    978-1-4673-0021-6
  • Type

    conf

  • DOI
    10.1109/CHUSER.2011.6163751
  • Filename
    6163751