Title :
Impact of assembly process technologies on electronic packaging materials
Author :
Tilford, T. ; Bailey, C. ; Parrott, A.K. ; Sinclair, K.I. ; Desmulliez, M.P.Y.
Author_Institution :
Comput. Mech. & Reliability Group, Univ. of Greenwich, London
Abstract :
Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss modelling results for microwave curing of polymer materials used in electronic packaging.
Keywords :
assembling; integrated circuit packaging; internal stresses; microwave heating; printed circuits; assembly process technologies; board warpage; electronic packaging materials; microwave curing; polymer materials; printed circuit boards; residual stresses; variable frequency microwave; Assembly; Bonding; Costs; Curing; Electromagnetic heating; Electronics packaging; Frequency; Polymers; Printed circuits; Residual stresses;
Conference_Titel :
Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on
Conference_Location :
Garmish-Partenkirchen
Print_ISBN :
978-1-4244-2141-1
Electronic_ISBN :
978-1-4244-2142-8
DOI :
10.1109/PORTABLE-POLYTRONIC.2008.4681300
