Development of transparent and flexible electrically conductive adhesives for microelectronics applications

A novel flexible electrically conductive adhesive (FECA) has been designed for electronic interconnect applications that require high flexibility on the flexible substrates and connectors. The physical properties of the resulting ECAs such as the elastic modulus, glass transition temperatures, adhesion strength and electrical properties were characterized by differential scanning calorimetry (DSC), dynamic mechanical analyzer (DMA), die shear tester and RCL multimeter. A high performance FECA with tunable modulus, flowability, glass transition temperature, electrical conductivity and adhesion strength was developed for the next-generation large scale flexible flat panel displays and printed electronics applications. Additionally, high transparency and flexibility ECAs have been achieved.