Title :
System packaging of thousands watt high power LEDs with heat pipe-fin air cooling system: Design and manufacturing
Author :
Xing Fu ; Zhangming Mao ; Xiaobing Luo
Author_Institution :
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
The extremely high power light emitting diode (LED) applications are desirable in the special lighting field. However, the thermal issue and reliability are the obstacles. In this work, a one thousand watt high power LED tennis court lamp was designed and manufactured. A heat pipe-fin heat radiator was used as the thermal solution. Simulations were conducted and the result showed the highest junction temperature of the LEDs was controlled at 92 °C. The lamp was lit and worked well.
Keywords :
LED lamps; heat pipes; reliability; LED tennis court lamp; extremely high power light emitting diode applications; heat pipe-fin air cooling system; heat radiator; junction temperature; lighting field; system packaging; temperature 92 degC; thermal issue; thermal reliability; Cooling; Electronic packaging thermal management; Heating; Light emitting diodes; Light sources; Optimization; Packaging; high power LED; system packaging; thermal management;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756661
