DocumentCode
3481888
Title
System packaging of thousands watt high power LEDs with heat pipe-fin air cooling system: Design and manufacturing
Author
Xing Fu ; Zhangming Mao ; Xiaobing Luo
Author_Institution
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
1146
Lastpage
1149
Abstract
The extremely high power light emitting diode (LED) applications are desirable in the special lighting field. However, the thermal issue and reliability are the obstacles. In this work, a one thousand watt high power LED tennis court lamp was designed and manufactured. A heat pipe-fin heat radiator was used as the thermal solution. Simulations were conducted and the result showed the highest junction temperature of the LEDs was controlled at 92 °C. The lamp was lit and worked well.
Keywords
LED lamps; heat pipes; reliability; LED tennis court lamp; extremely high power light emitting diode applications; heat pipe-fin air cooling system; heat radiator; junction temperature; lighting field; system packaging; temperature 92 degC; thermal issue; thermal reliability; Cooling; Electronic packaging thermal management; Heating; Light emitting diodes; Light sources; Optimization; Packaging; high power LED; system packaging; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756661
Filename
6756661
Link To Document