Title :
Influence of rapid thermal cycling on optical property and microstructure of high power LED
Author :
Jibing Chen ; Bing An ; Longzao Zhou ; Yiping Wu
Author_Institution :
Wuhan Polytech. Univ., Wuhan, China
Abstract :
This paper describes the effect of rapid thermal cycling on optical performance of high power light emitting diode (LED) by induction heating. Under an application of induction heating as rapid heating source, the specimens that were being non-operating and operating life tests in the experiment were rapidly heated and cooled based on a control system that employs a fuzzy logic algorithm, respectively. The optical performances, including luminous flux, luminous efficiency and radiant power of two kinds of LED specimens were compared and analyzed. It was found that the rapid thermal cycling have similar evident influence on them. The results showed that the color purity of LED was also descended, the correlated color temperature (CCT) was also risen, but their changing rate and extents are different. The high and low temperature distribution in LED chip was simulated by finite element modeling (FEM) which is helpful for the failure analysis and design of the reliability of the LED packaging. The microstucrue of LED chips are analyzed after different rapid thermal cycling time. The results are showed that rapid thermal cycling can affect greatly the LED properties and interface microstructures. All the results indicate that this approach to rapid thermal cycling by using rapid heating source is feasible to investigate the optical performance of high power LED, so it can also effectively verify the reliability of LED devices.
Keywords :
finite element analysis; fuzzy logic; induction heating; light emitting diodes; optical properties; rapid thermal processing; temperature distribution; FEM; LED chip microstucture; LED packaging; correlated color temperature; failure analysis; finite element modeling; fuzzy logic algorithm; high power LED microstructure; high power light emitting diode; high temperature distribution; induction heating; interface microstructure; low temperature distribution; luminous efficiency; luminous flux; optical property; radiant power; rapid heating source; rapid thermal cycling; Color; Electromagnetic heating; Electronic packaging thermal management; Light emitting diodes; Metals; Soldering; high-power LED; induction heating; microstucture; optical property; rapid thermal cycling;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756663