Title :
A mechanical screening method for glass passivated wafers
Author :
Bucheru, B.T. ; Turtudau, F. ; Ichim, Any ; Iosif, Rita ; Marinescu, V.A.
Author_Institution :
S.C. Baneasa S.A., Bucharest, Romania
Abstract :
The paper presents a method for the improvement of product reliability based on screening at the wafer fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish a mechanical screening procedure based on the correlation between the resistance to applied pressure of glass passivated chips and the results of standard reliability RTV test (rapid thermal variations)
Keywords :
automotive electronics; environmental stress screening; passivation; power semiconductor diodes; semiconductor device reliability; semiconductor device testing; solid-state rectifiers; DO21; RTV testing; automotive rectifier diode; glass passivated chip; mechanical screening; pressure resistance; product reliability; semiconductor manufacturing; wafer fabrication; Automotive engineering; Fabrication; Glass; High temperature superconductors; Rectifiers; Semiconductor diodes; Silicon; Stress; Testing; Thermal resistance;
Conference_Titel :
Semiconductor Conference, 1999. CAS '99 Proceedings. 1999 International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-5139-8
DOI :
10.1109/SMICND.1999.810503
