DocumentCode
348201
Title
A mechanical screening method for glass passivated wafers
Author
Bucheru, B.T. ; Turtudau, F. ; Ichim, Any ; Iosif, Rita ; Marinescu, V.A.
Author_Institution
S.C. Baneasa S.A., Bucharest, Romania
Volume
1
fYear
1999
fDate
1999
Firstpage
227
Abstract
The paper presents a method for the improvement of product reliability based on screening at the wafer fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish a mechanical screening procedure based on the correlation between the resistance to applied pressure of glass passivated chips and the results of standard reliability RTV test (rapid thermal variations)
Keywords
automotive electronics; environmental stress screening; passivation; power semiconductor diodes; semiconductor device reliability; semiconductor device testing; solid-state rectifiers; DO21; RTV testing; automotive rectifier diode; glass passivated chip; mechanical screening; pressure resistance; product reliability; semiconductor manufacturing; wafer fabrication; Automotive engineering; Fabrication; Glass; High temperature superconductors; Rectifiers; Semiconductor diodes; Silicon; Stress; Testing; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 1999. CAS '99 Proceedings. 1999 International
Conference_Location
Sinaia
Print_ISBN
0-7803-5139-8
Type
conf
DOI
10.1109/SMICND.1999.810503
Filename
810503
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