• DocumentCode
    3482090
  • Title

    Reliability test and failure analysis of high-brightness LEDs from Cree under the various injection currents

  • Author

    Liu, Wenxin ; Li, Ning ; Lei, Pui-Sun ; Zou, B.B. ; Jin, Ping

  • Author_Institution
    Shenzhen Grad. Sch., Sch. of Environ. & Energy, Peking Univ., Shenzhen, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    1184
  • Lastpage
    1188
  • Abstract
    In this paper, the reliability and degradation mechanisms of high-brightness LEDs were studied, which were prepared by Cree and currently available on the market. Results revealed that operating currents had an important effect on the service performance of treated LEDs. Only at 350mA the tested LEDs had a good performance; at 750mA and 1000mA, they had the significant degradation; at 2000mA, they had the serious failure of death light within 24 hours. Encapsulant carbonization, delamination and interfacial defects were found to contribute to the degradation of high power LEDs. This study would provide some guidance for the end users as well as some basic data for the current package technique.
  • Keywords
    brightness; delamination; failure analysis; light emitting diodes; reliability; semiconductor device testing; current 1000 mA; current 2000 mA; current 350 mA; current 750 mA; degradation; delamination; encapsulant carbonization; failure analysis; high-brightness LED; injection currents; interfacial defects; reliability test; time 24 hour; Aging; Color; Degradation; Light emitting diodes; Phosphors; Reliability; Rendering (computer graphics); LED package technique; electrical stress; failure; high power LEDs; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756670
  • Filename
    6756670