Laser-induced self-propagating reaction in Ti/a-Si multilayer films

Author

Mei Zhu ; Rong An ; Chunqing Wang ; Xingyao Fu

Author_Institution

Key Lab. of Micro-Syst. & Micro-Struct., Manuf., Harbin Inst. of Technol., Harbin, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

1227

Lastpage

1230

Abstract

In this paper, we choose Ti/a-Si multilayer films as our Nano-scale reaction systems for its high mount of exothermic energy and low induction energy. The films are fabricated by magnetron sputtering layer by layer. AFM and TEM are used to characterize surface roughness and cross section structure of the material systems. Then, we succeed in using laser with different amount of energy to induce self-propagating reaction in Ti/a-Si multilayer films. At the same time, we take advantage of high speed cameras to investigate and record the process of the reaction and its velocity. Finally, we use SEM and XRD methods to analyze the reaction product. Result shows that very thin Ti/a-Si films can be induced by laser with low energy. If the stability and handling properties can be improved, Ti/a-Si multilayer film is a strong candidate in the field of nanoscale application.

Keywords

X-ray diffraction; amorphous semiconductors; atomic force microscopy; elemental semiconductors; laser materials processing; multilayers; scanning electron microscopy; silicon; sputter deposition; surface roughness; thin films; titanium; transmission electron microscopy; AFM; SEM; TEM; Ti-Si; XRD; cross section structure; exothermic energy; handling properties; high speed camera; induction energy; laser-induced self-propagating reaction; layer by layer magnetron sputtering; material systems; multilayer films; nanoscale application; nanoscale reaction systems; reaction product; stability properties; surface roughness; Films; Heating; Nonhomogeneous media; Power lasers; Rough surfaces; Surface roughness; Ti/a-Si multilayer films; laser; self-propagating reaction;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756679

Filename

6756679